Capable of Running One or Tens of Thousands, Single-Sided or Intricate 24-Layer Boards
K&F Electronics Capabilities
TYPES OF BOARDS MANUFACTURED:
Single sided, double sided, multi-layer, Teflon, Polyimide, Rogers Materials, Aluminum, Flex, Blind And Burried Via.
MANUFACTURING VOLUMES:
1 piece prototypes through production volumes.
MAXIMUM NUMBER OF LAYERS:
24
MAXIMUM BOARD SIZE:
17 x 23 inches
MAXIMUM FINISHED BOARD THICKNESS:
.125 inch.
BOARD FLATNESS TOLERANCE:
.001 inch/inch.
MINIMUM HOLE SIZE:
.005 inch.
ANNULAR RING:
.0075 inch
FINISHED TRACE WIDTH:
INSIDE: .004 inch
OUTSIDE: .006 inch
SPACING BETWEEN TRACES:
INSIDE: .004 inch.
OUTSIDE: .006 inch
SMT PITCH:
.012 inch.
COPPER TO BOARD EDGE:
.015 inch for scoring
BOARD FINISHES:
Bare copper, HASL, Gold, White Tin, Silver, OSP, Lead-Free HASL
SOLDER MASK:
Almost any color
CORE THICKNESS:
.004 inch
MATERIAL TYPES:
FR-4, CEM-1, Teflon, Polyimide, Rogers RO4003C, Aluminum Core, Flex
CONTROLLED IMPEDANCE:
Yes
COPPER THICKNESS:
(foil) 0.5 oz. thru 4 oz.
MINIMUM DIELECTRIC THICKNESS:
.004 inch
TESTING CAPABILITY:
Single Sided, Double Sided – Double Density, Flying Probe
QUALITY SPECIFICATIONS:
MIL-Q-9858
CERTIFICATIONS:
ISO 9001 : 2015, UL, (ISO 14010 In the works), Cage Code 1TQ60, ITAR Approved